Discover how thin conductive layers outperform thermoplastic compounds in EMI shielding, while durable metal-plastic adhesion enables robust integration into thermoplastic components. EMI shielding by thermoplastics is often aimed to be accomplished through compound development. However, when electromagnetic performance is critical, that strategy quickly reaches its limits as shown by linking experimental results to simple model calculations of shielding effectiveness from the conductivity and thickness of the shielding layer. Thin, highly conductive layers such as metallized coatings, continuous carbon fiber layers, and metal grids outperform conventional thermoplastic compounds by a wide margin, especially when dealing with low frequency magnetic fields (near field shielding). The podcast furthermore addresses durable metal to plastic adhesion incl. how electroplated metal layers can be robustly integrated into thermoplastic components.
Discover how thin conductive layers outperform thermoplastic compounds in EMI shielding, while durable metal-plastic adhesion enables robust integration into thermoplastic components.
EMI shielding by thermoplastics is often aimed to be accomplished through compound development. However, when electromagnetic performance is critical, that strategy quickly reaches its limits as shown by linking experimental results to simple model calculations of shielding effectiveness from the conductivity and thickness of the shielding layer. Thin, highly conductive layers such as metallized coatings, continuous carbon fiber layers, and metal grids outperform conventional thermoplastic compounds by a wide margin, especially when dealing with low frequency magnetic fields (near field shielding). The podcast furthermore addresses durable metal to plastic adhesion incl. how electroplated metal layers can be robustly integrated into thermoplastic components.